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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol Parameter
Min.
Max.
Units
Charged Device Model per JESD22-C101
V IN
V FB , V EN
V SW
V OUT
ESD
T J
T STG
T L
VIN
FB, EN Pins
SW Pin
VOUT Pin
Electrostatic Discharge Protection Human Body Model per JESD22-A114
Level
Junction Temperature
Storage Temperature
Lead Soldering Temperature, 10 Seconds
-0.3
-0.3
-0.3
–0.3
-40
-65
6.0
V IN + 0.3
22.0
22.0
3.3
2.0
+150
+150
+260
V
V
V
V
kV
°C
°C
°C
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
V IN
Parameter
VIN Supply Voltage
Comments
Min.
2.7
Max.
5.5
Units
V
V OUT
VOUT Voltage
(1)
6.2
17.5
V
I OUT
T A
T J
VOUT Load Current
Ambient Temperature
Junction Temperature
500mW Maximum Output Power
5
-40
-40
25
+85
+125
mA
°C
°C
Note:
1.
Application should guarantee that minimum and maximum duty-cycle should fall between 20-85% to meet the specified
range
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer 2s2p
boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature T J(max) at a
given ambient temperature T A .
Symbol Parameter
Typical
Units
θ JA
Junction-to-Ambient Thermal Resistance, UMLP6 Package
70
°C/W
? 2009 Fairchild Semiconductor Corporation
FAN5341 ? Rev. 1.0.1
4
www.fairchildsemi.com
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